ITW EAE Support Center
Information Sheets
Information sheets
- Correction of flux density
- Board sagging due to temperature difference between top side and solder side
- Fluxes for (SMD) soldering
- Calculations on flux consumption with a spray fluxer
- Determination of the tin lead ratio by density measurment
- Difficulties and how to avoid them when soldering PCBs with non plated through holes
- General information about sagging of printed circuit boards during the soldering process
- How to keep solderpad holes open in non-plated mounting holes
- Improvement of wave soldering of SOT23 by enlarging soldering pads
- Lead free silver containing solder alloys